ELT 393 - Fabrication Techniques

1. Comprehend the difference between schematics and packaging choices.
   1. Understand schematic symbols and associate with multiple package diagrams.
   2. Choose the proper package for the appropriate application requirements.
   3. Create a schematic diagram from a circuit board
2. Using Schematic and PCB design software
   1. Create the title block that will be used for all drawings
   2. Use schematic capture software to draw a schematic diagram
   3. Demonstrate how to create a custom symbol library.
   4. Associate package layouts to schematic symbols
   5. Transfer and troubleshoot schematic to PCB layouts
   6. Manipulate PCB layouts using auto placement and auto routing tools.
   7. Create 3D circuit board layouts for project proposals
   8. Generate industry standard Gerber and N/C export files for automated circuit board manufacturing.
3. Be able to build prototype circuits and finished PCBs.
4. Produce a single/double sided circuit board:
   1. Import files and set up automated milling equipment.
   2. Demonstrate automated milling proficiency
   3. Investigate and solve milling errors.
5. Desolder and solder surface mount pc board electronic components.
   1. Remove and resolder teacher designated ICs from a printed circuit board using soldering wick without damage.
   2. Remove and resolder teacher disignated ICs from a printed circuit board using continouos vacuum without damage.
6. Distinguish the elements of a project proposal, and complete/present a final project.
7. Describe different fabrication techniques for making printed circuit boards.
   1. Layout.
   2. Function of multi-layer boards
   3. Steps involved in board production
   4. Economics of mass production
8. Use appropriate safety standards for :
   1. Handheld tools
   2. Automated milling equipment and cleaning chemicals
   3. Personal safety equipment
   4. Handling of semiconductors
   5. ESD prevention